Semiconductor device mounting jig

ABSTRACT

A semiconductor device mounting jig capable of holding a flexible tape substrate or other board flat and stable, provided with a holding plate having a flat mounting board holding surface integrally formed at an opening of a plate support having a hollow portion inside and having the opening communicated with the hollow portion or fit in the opening of the plate support through an O-ring, suction holes penetrating through the holding plate at the mounting board holding surface, and a suction means for applying suction at the suction holes from the opposite side to the mounting board holding surface such as applying suction at the hollow portion of the plate support, the mounting board being placed on the mounting board holding surface to cover the suction holes and the suction means applying suction to the hollow portion to hold and fix the mounting board by suction, and a method of mounting a semiconductor device using the same.

RELATED APPLICATION DATA

[0001] The present application claims priority to U.S. patentapplication Ser. No. 09/588,289 filed Jun. 7, 2000 and to JapaneseApplication No. P1 1-168091 filed Jun. 15, 1999, each of which isincorporated herein by reference to the extent permitted by law.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to a semiconductor device mountingjig and a method of mounting a semiconductor device, more particularlyrelates to a method of mounting a semiconductor device having a packageform made to be compact and high density and a semiconductor devicemounting jig used therefor.

[0004] 2. Description of the Related Art

[0005] Demand for more compact, thinner, and lighter digital videocameras, digital cellular phones, laptop personal computers, and otherportable electronic devices has been increasing steadily. To meet thedemand, a 70% reduction in three years has been realized and smallersizes and high performance have been achieved in recent VLSIs and othersemiconductor devices.

[0006] Along with the higher performance of semiconductor devices,semiconductor device packages have been made smaller and higher innumber of pins. There has been a shift from the conventionally broadlyused dual inline packages (DIP) and other through hole mount devices(THD) inserting leads into through holes formed in a printed board toquad flat (L-leaded) packages (QFP) and other surface mount devices(SMD) mounted by soldering lead terminals on the surface of a board andfurther to ball grid array (BGA) packages with output terminals providedat areas on the bottom surface.

[0007] Further, a package called a chip size package (CSP), also calleda fine-pitch BGA (FBGA), having terminals on its bottom surface, makingthe package size close to the size of the semiconductor chip, andrealizing further compactness and higher density has been developed andput into broad use up to now.

[0008] As the method of mounting a semiconductor chip of the above CSPformat, flip-chip mounting for directly mounting a bare LSI chip withthe pad opening surface side facing to the mounting board or mounting anLSI chip to a buffer base called an “interposer” to make a CSP andmounting this on a mounting board has come into note.

[0009] In flip-chip mounting, the LSI chip is provided with projectingelectrodes such as gold stud bumps and solder bumps.

[0010] Flip-chip mounting using solder bumps enables simultaneousmounting of a large number of LSI chips when using reflow of the solderbumps, so the productivity is extremely high. Also, compared withconnection using gold stud bumps, there is the advantage that bondingwith a low load is possible.

[0011] Generally, in flip-chip mounting using reflow of the solderbumps, a rigid substrate comprised of glass-epoxy etc. is used.

[0012] On the other hand, flip-chip mounting may also be conducted usinga flexible tape substrate formed by processing polyimide or anotherinsulating resin to a tape shape and having the advantage of being thinand light weight.

[0013] However, since a flexible tape substrate is more flexible than arigid substrate, a flexible tape substrate easily flexes in the processof mounting an LSI chip by flip-chip mounting, therefore easily suffersfrom problems in connection of the solder bumps described below.

[0014] When, for example as shown in FIG. 9, mounting a semiconductordevice 5 comprised of an LSI chip 50, electrodes 51 connected to itspads, and solder bumps 52 formed on the electrodes, on to a flexibletape substrate 4 comprised of a highly flexible substrate 40 on whichlands (electrodes) 41 a are formed, if mounting by reflow of the solderbumps while the flexible tape substrate 4 is left flexed, unconnectedportions U arise between the solder bumps 52 and lands 41 a, andalternatively, in the case of a semiconductor 5 having a narrow pitch Pbetween adjacent solder bumps 52, bridges B occur between adjacentsolder bumps 52 and other problems arise easily in solder bumpconnection.

[0015] To prevent the above disadvantages in solder bump connection, itis necessary to keep the flexible tape substrate 4 flat duringespecially narrow pitch P flip-chip soldering by reflow.

[0016] As a method of reflow while keeping the flexible tape substrate 4flat, a method of affixing the flexible tape substrate 4 on a holdingbase using an adhesive tape (see Japanese Unexamined Patent Publication(Kokai) No. 8-222820) and a method of forming through holes in theflexible tape substrate 4 in advance and affixing the flexible tapesubstrate 4 by fitting them over projections formed on the holding base(see Japanese Unexamined Patent Publication (Kokai) No. 8-254996) havebeen proposed.

[0017] The above two methods, however, have disadvantages that the areafor holding the flexible tape substrate 4 is small, the holding force isweak, and the flexible tape substrate 4 sometimes comes off from theholding base.

[0018] Also, a method of affixing the flexible tape substrate 4 on theholding base by an adhesive or two-sided adhesive tape may beconsidered.

[0019] In this case, however, at the time of release, that is, detachingthe flexible tape substrate 4 from the holding base, stress ends upbeing imposed on the semiconductor device. The semiconductor device isliable to be damaged in some cases.

SUMMARY OF THE INVENTION

[0020] An object of the present invention is to provide a semiconductordevice mounting jig capable of stably holding a flexible tape substrateflat in a process of mounting a semiconductor device on the flexibletape substrate by flip-chip mounting and not applying stress to thesemiconductor device at the time of release and a method of mounting asemiconductor device mounted on a flexible tape substrate by using thesemiconductor device mounting jig.

[0021] To attain the above object, according to a first aspect of thepresent invention, there is provided a semiconductor device mounting jigfor holding a mounting board flat when mounting a semiconductor deviceon the mounting board, comprising a holding plate having a flat mountingboard holding surface; suction holes penetrating through the holdingplate at the mounting board holding surface; and a suction means forapplying suction at the suction holes from an opposite side to themounting board holding surface; suction being applied at the suctionholes while the mounting board is placed on the mounting board holdingsurface so as to hold the mounting board by suction.

[0022] Preferably, the holding plate is fit into an opening of a platesupport having a hollow portion inside it and the opening communicatedwith the hollow portion and the suction means applies suction to thehollow portion to apply suction at the suction holes from the oppositeside to the mounting board holding surface.

[0023] Preferably, a suction nozzle communicating with the hollowportion is provided at the plate support; and a suction pump isconnected to the suction nozzle to apply suction to the hollow portion.

[0024] More preferably, a valve for opening and shutting the suctionnozzle is provided at the suction nozzle; and the suction pump can beattached to or removed from the suction nozzle.

[0025] Preferably, the holding plate and the plate support are made asone body.

[0026] Preferably, the holding plate is fit into the opening of theplate support through an O-ring.

[0027] That is, the above semiconductor device mounting jig of thepresent invention comprises a holding plate having a flat mounting boardholding surface integrally formed at an opening of a plate supporthaving a hollow portion inside it and the opening communicated with thehollow portion or fitted in the opening of the plate support through anO-ring, suction holes in the mounting board holding surface penetratingthrough the holding plate, and a suction means for applying suction atthe suction holes from the opposite side to the mounting board holdingsurface such as applying suction at the hollow portion of the platesupport.

[0028] Accordingly, by placing a mounting board on the mounting baseholding surface while applying suction from the suction holes, theflexible tape substrate is held by suction and kept flat and stable inthe process of mounting a semiconductor device on a flexible tapesubstrate by flip-chip mounting etc. Further, the hold can be easilyreleased by releasing suction to return to a normal pressure, so nostress is imposed on the semiconductor device.

[0029] Further, when configured so that a valve is provided at thesuction nozzle and a suction pump can be attached to or removed from thesuction nozzle, after holding the mounting board on the mounting boardholding surface, the mounting board can be kept held even if the suctionpump is removed from the suction nozzle by closing the valve of thesuction nozzle.

[0030] According to a second aspect of the present invention, there isprovided a method of mounting a semiconductor device, comprising stepsof placing a mounting board on a flat mounting board holding surface ofa semiconductor device mounting jig comprising a holding plate havingthe mounting board holding surface, suction holes penetrating throughthe holding plate at the mounting board holding surface, and a suctionmeans for applying suction at the suction holes from an opposite side tothe mounting board holding surface, and applying suction at the suctionholes to hold the mounting board; placing a semiconductor device on themounting board; and connecting the semiconductor device to the mountingboard.

[0031] Preferably, a flexible tape substrate comprising a substrate madeof an insulating resin processed to form a tape shape and formed with aninterconnection pattern is used as the mounting board; in the step ofplacing the semiconductor device, the semiconductor device is placed sothat bumps formed previously on the semiconductor device contact theinterconnection pattern; and in the step of connecting the semiconductordevice to the mounting board, the bumps are connected to theinterconnection pattern.

[0032] Preferably, in the step of connecting the semiconductor device tothe mounting board, the semiconductor device is connected with solder tothe mounting board.

[0033] More preferably, in the step of connecting the semiconductordevice to the mounting board, the semiconductor device is connected tothe mounting board by reflow of the solder.

[0034] Preferably, the method further includes, after connecting thesemiconductor device to the mounting board, a step of injecting asealing resin in a gap between the mounting board and the semiconductordevice in the state holding the mounting board on the mounting boardholding surface of the semiconductor device mounting jig and a step ofhardening the sealing resin to seal the gap between the mounting boardand the semiconductor device in the state holding the mounting board onthe mounting board holding surface.

[0035] That is, the method of mounting a semiconductor device of thepresent invention places on the mounting board holding surface of asemiconductor device mounting jig—provided with a holding plate having aflat mounting board holding surface, suction holes penetrating throughthe holding plate at the mounting board holding surface, and a suctionmeans for applying suction at the suction holes from the opposite sideto the mounting board holding surface—a flexible tape substrate or othermounting board comprising a substrate comprised of an insulating resinformed to a tape shape and formed with an interconnection pattern andapplies suction from suction holes so as to hold the mounting board.

[0036] Next, a semiconductor device is mounted on the mounting boardwhile bringing bumps formed in advance on the semiconductor device tocontact with the interconnection pattern of the mounting board.

[0037] Then, the semiconductor device is connected to the mounting boardby connecting the interconnection pattern etc. to the bumps by reflowetc.

[0038] According to the method of mounting a semiconductor device of thepresent invention, by placing a mounting board on the mounting boardholding surface while applying suction at suction holes, it is possibleto apply suction to a flexible tape substrate or other mounting board tohold it flat and stable and to mount a semiconductor device on themounting board by flip-chip mounting etc. Also, by releasing the suctionto return to a normal pressure, the hold can be released withoutimposing any stress on the semiconductor device.

[0039] Furthermore, by injecting a sealing resin in the gap between themounting board and the semiconductor device in the state holding themounting board on the mounting board holding surface and hardening thesealing resin, it is possible to seal with resin in the state holdingthe flexible tape substrate or other mounting board flat and stable.

BRIEF DESCRIPTION OF THE DRAWINGS

[0040] These and other objects and features of the present inventionwill become clearer from the following description of the preferredembodiments given with reference to the accompanying drawings, in which:

[0041]FIGS. 1A and 1B are perspective views of a semiconductor devicemounting jig according to the present invention;

[0042]FIG. 2 is a schematic sectional view corresponding to a part of asectional view along the line A-A′ in FIG. 1B;

[0043]FIGS. 3A and 3B are schematic sectional view of steps of a methodof mounting a semiconductor device according to an embodiment of thepresent invention, wherein FIG. 3A is a view up to a step of holding amounting board and FIG. 3B is a view up to a step of mounting thesemiconductor device;

[0044]FIGS. 4A and 4B are schematic sectional views of the followingsteps of FIGS. 3A and 3B, wherein FIG. 4A is a view up to a step ofsoldering by reflow and FIG. 4B is a view up to a step of releasing themounting board;

[0045]FIGS. 5A and 5B are schematic sectional views of steps of a methodof mounting a semiconductor device according to an embodiment of thepresent invention, wherein FIG. 5A is a view up to the step of solderingby reflow and FIG. 5B is a view up to a step of flux washing;

[0046]FIGS. 6A and 6B are schematic sectional views of following stepsof FIGS. 5A and 5B, wherein FIG. 6A is a view up to a step of resinsealing and FIG. 6B is a view up to a step of releasing the mountingboard;

[0047]FIG. 7 is a perspective view of a semiconductor device mountingjig according to an embodiment of the present invention;

[0048]FIG. 8 is schematic sectional view of a method of mounting asemiconductor device according to an embodiment of the presentinvention; and

[0049]FIG. 9 is a sectional view showing a disadvantage of the method ofmounting a semiconductor device according to the related art.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0050] Below, preferred embodiments of a semiconductor device 5 mountingjig 100 of the present invention and a method of mounting thesemiconductor device 5 using the same will be described with referenceto the accompanying drawings.

[0051]FIG. 1A is a perspective view of the configuration of asemiconductor device 5 mounting jig 100 according to the presentinvention.

[0052] The semiconductor device 5 mounting jig 100 comprises a holdingplate 1 and a plate support 2.

[0053] The holding plate 1 is formed by a suction plate 10 having a flatmounting board holding surface provided with a suction pattern 13comprised of suction holes 11 and grooves 12.

[0054] The suction holes 11 are formed penetrating through the suctionplate 10 from the side holding the flexible tape substrate 4 etc., thatis, the mounting board holding surface, to the opposite side. Thesuction holes 11 are essential parts for holding by suction andpreferably have hole diameters of 0.01 to 1 mm.

[0055] On the other hand, the grooves 12 are formed in the suction plate10 at the mounting board holding surface. The grooves 12 are additionalparts for holding the flexible tape substrate 4 more reliably andpreferably have a width of 0.1 to 1 mm. The grooves 12 can be omitted ifnot necessary.

[0056] The suction plate 10 is preferably made by a material superior inflatness, easy to make holes in or otherwise machine, and with littleheat deformation when heated to a peak temperature of reflow (generally230 to 240? C.) or so and, for example, is made from stainless steel,ceramics, etc.

[0057] The plate support 2 is comprised of a plate support body 20 inwhich is formed a hollow portion 20 a. An opening 21 is formedcommunicating with the hollow portion 20 a. An O-ring 22 is provided atan inner wall of the opening 21. The holding plate 1 is fit in theopening 21 through the O-ring 22 at the time of use.

[0058] Also, at least one suction nozzle 23 is provided communicatedwith the hollow portion 20 a and a valve 24 is provided for maintainingthe reduced pressure state of the hollow portion 20 a reduced inpressure by suction. The suction nozzle 23 is connected to a notillustrated suction pump 3. The suction pump 3 is detachable.

[0059] The plate support body 20 is preferably made by a material easyto make holes in, form a hollow portion in, or otherwise machine, andwith little heat deformation when heated to the peak temperature(generally, 230 to 240° C.) of reflow or so and is formed for example bystainless steel, ceramics, etc.

[0060]FIG. 1B is a perspective view of a semiconductor device 5 mountingjig 100 (mounting board holding jig 100) according to the presentinvention and shows the state of assembly after fitting the holdingplate 1 in the opening 21 of the plate support 2 through the O-ring 22.

[0061]FIG. 2 is a schematic sectional view corresponding to a part of asectional view along the line A-A′ in FIG. 1B.

[0062] The plate support 2 is comprised of the plate support body 20inside of which is provided the hollow portion 20 a and provided withthe opening 21 communicated with the hollow portion 20 a.

[0063] The holding plate 1 comprised of the suction plate 10 providedwith a suction pattern 13 comprised of suction holes 11, grooves 12,etc. is fitted in the opening 21 through the not shown O-ring 22.

[0064] Also, at least one suction nozzle 23 is provided communicatedwith the hollow portion 20 a and a valve 24 is provided for maintainingthe reduced pressure state of the hollow portion 20 a reduced inpressure by suction. The suction nozzle 23 is connected to a suctionpump 3. The suction pump 3 is detachable.

[0065] In the above mounting board holding jig 100, the hollow portion20 a is reduced in pressure by applying suction by the suction pump 3 inthe state with the board 4 to be held placed on the mounting boardholding surface 102 of the suction plate 10 and covering the suctionpattern 13 so that the holding plate 1 and the plate support 2 are fixedand the board 4 is held and fixed by the suction pattern 13.

[0066] After the hollow portion 20 a is once reduced in pressure, thereduced pressure state is maintained, even when the suction pump 3 isremoved, by closing the valve 24. The held board 4 therefore continuesto be held by suction by the suction pattern 13.

[0067] In the above mounting board holding jig 100, the flatness of theflexible tape substrate 4 or other held board 4 may be damaged by thesuction pattern. To prevent this, the suction pattern 13 is preferablydesigned, considering the arrangement of electrodes (lands) 41 a of theflexible tape substrate 4 or other board 4 to be soldered, so that thesuction holes 11, grooves 12, etc. are not arranged directly below theelectrodes (lands) 41 a.

[0068] The mounting board holding jig 100 of the present embodiment isconfigured so that the suction plate 10 is detachable and is thereforecapable of handling mounting boards 4 having a variety of electrodepatterns 41 by just changing the suction pattern 13 of the suction plate10, therefore can be widely used.

[0069] The method of mounting a semiconductor device 5 on a flexibletape substrate 4 by using the above mounting board holding jig 100 willbe explained next by referring to a schematic sectional viewcorresponding to FIG. 2, which is a schematic sectional viewcorresponding to a part of a sectional view along the line A-A′ in FIG.1B. Simultaneous mounting of a large number of semiconductor devices 5is possible by using a large number of semiconductor devices 5 (LSIchips) and a corresponding mounting board 4 (flexible tape substrate 4).

[0070] First, as shown in FIG. 3A, the suction pump 3 is operated in thestate with the flexible tape substrate 4 placed on the mounting boardholding surface 102 of the suction plate 10 and covering the suctionpattern 13. As a result, the hollow portion 20 a is reduced in pressure,the holding plate 1 and support 2 are fixed, and the held board 4 isfurther held and fixed by suction by the suction pattern 13.

[0071] The above flexible tape board 4 comprises a conductive pattern 41and insulation portions (40, 42). A part of the conductive pattern 41exposed from an opening of the insulation portions (40, 42) becomes aland (electrode) 41 a.

[0072] Preferably, the conductive pattern 41 is made of a metal having alow resistance. For example, copper may be used.

[0073] The insulation portions (40, 42) preferably are made of a resinhaving a low dielectric constant. For example, a polyimide resin orepoxy resin may be used. The insulation portions (40, 42) are preferablyformed on both sides of the conductive pattern 41. Also, the insulationportions (40, 42) formed on the two sides of the conductive pattern 41do not necessarily have to be the same material.

[0074] The thickness of the flexible tape substrate 4 is for example notmore than 0.5 mm, preferably 0.05 to 0.2 mm.

[0075] Next, after the hollow portion 20 a is reduced in pressure andthe suction pattern 13 holds the flexible tape substrate 4 by suction,the valve 24 is closed and the suction pump 3 is removed whilemaintaining the reduced pressure state of the hollow portion 20 a. Sincethe valve 24 of the suction nozzle 23 is closed, the held state of theflexible tape substrate 4 can be maintained even if the suction pump 3is removed from the suction nozzle 23.

[0076] As explained above, the flexible tape substrate 4 is held andfixed flat by suction by the mounting board holding jig 100 having aholding plate 1 with a flat surface.

[0077] Next, as shown in FIG. 3B, flux 41 b is supplied to the lands 41a of the held flexible tape substrate 4, then a semiconductor device 5comprised of a semiconductor chip 50 connected in its pad openings witha ball limiting metal (BLM) 51 or other conductive film and solder ballbumps 52 formed on the same is mounted on the flexible tape substrate 4with the lands 41 a and solder ball bumps 52 aligned. This state will becalled the “work 6”.

[0078] Next, as shown in FIG. 4A, the work 6 is passed through a reflowfurnace to heat it higher than the solder melting temperature and meltthe solder bumps 52. At this time, the oxide film on the solder portions52 and land portions 41 a is removed by the flux and the solder 52 wetsthe lands 41 a of the flexible tape substrate 4. By cooling andhardening the solder 52 in this state, soldering (reflow) is conductedto electrically and mechanically connect the semiconductor device 5 andthe flexible tape substrate 4.

[0079] Next, as shown in FIG. 4B, the valve 24 of the mounting boardholding jig 100 is loosened for easing the reduced pressure state of thehollow portion 20 a and thereby release the hold of the flexible tapesubstrate 4 with the semiconductor device 5 soldered to it, easily withlittle stress.

[0080] Furthermore, after the above soldering of the semiconductordevice 5 to the flexible tape substrate 4, sealing resin 8 is injectedinto the gap 104 between the flexible tape substrate 4 and thesemiconductor device 5 and hardened in the state with the flexible tapesubstrate 4 soldered with the semiconductor device 5 held on themounting board holding surface 102. Therefore, resin sealing is possiblefor easing the stress at flip-chip soldered portions while holding theflexible tape substrate 4 flat and stable.

[0081] The above method will be explained further below.

[0082]FIG. 5A shows the state of the flexible tape substrate 4 with thesemiconductor device 5 shown in FIG. 4A soldered to it held on themounting board holding surface 102. The flexible tape substrate 4 withthe semiconductor device 5 soldered to it held on the mounting boardholding surface 102 of the above mounting board holding jig 100 iscalled a “work 6” in the same way as above.

[0083] The work 6 in the state shown in FIG. 5A is dipped in a fluxresidue washing solution 7 in a flux washing bath 70 as shown in FIG.5B. At this time, at least the solder junction portions are sufficientlydipped in the flux residue washing solution 7. Due to this, flux 41 bresidue (not shown) arising at the time of soldering is washed off.

[0084] As the above flux residue washing solution 7, for example Elise(phonetic) M9000 (product name, Asahi-Kasei Co.) etc. may be used.

[0085] Next, as show in FIG. 6A, a heat curing resin, that is, an epoxyresin or other sealing resin 8, is supplied from a dispenser 80 topervade the gap 104 between the semiconductor device 5 and the flexibletape substrate 4.

[0086] Then, heat treatment is performed for curing the sealing resin 8to seal with resin 8 the flip-chip soldered portions 52 while holdingthe flexible tape substrate 4 flat and stable.

[0087] Next, as shown in FIG. 6B, the valve 24 of the mounting boardholding jig 100 is loosened to release the reduced pressure state of thehollow portion 20 a and thereby enable release of the hold on theflexible tape substrate 4 with the semiconductor device 5 soldered to itand with the resin 8 sealed soldered portions 52 easily with smallstress to the semiconductor device 5.

[0088] According to the present embodiment, by placing a mounting board4 on the mounting board holding surface 102 and applying suction fromthe suction holes 11, it is possible to hold a flexible tape substrate 4or other mounting board 4 having a high flexibility flat and stable topermit mounting a semiconductor device 5 on the mounting board 4 byflip-chip mounting etc.

[0089] Also, by releasing the suction and returning to a normalpressure, the hold can be easily released without applying stress to thesemiconductor device 5.

[0090] Furthermore, by injecting sealing resin 8 into the gap 104between the mounting board 4 and the semiconductor device 5 andhardening the resin 8 in a state holding the mounting board 4 on themounting board holding surface 102, resin 8 sealing is possible whileholding a flexible tape substrate 4 or other mounting board 4 flat andstable.

[0091] Note that as the mounting board holding jig 200, as shown in FIG.7, the holding plate 1 and the plate support 2 may be integrally formed.As a method of forming an integrated jig 200, there is a method ofbrazing a separately made holding portion 1 and plate support 2 toeliminate the need for the O-ring 22.

[0092] Also, in the above embodiments, as shown in FIG. 8, it is ofcourse possible to hold the flexible tape substrate 4 or other mountingboard 4 by the above mounting board holding jig 200, mount together asurface mounting device 53 besides a semiconductor device 5 formed withsolder bumps 52, and mount the same by reflow.

[0093] The semiconductor device 300 produced by the present inventionmay be any semiconductor device 5 such as a MOS transistor typesemiconductor device 5, a bipolar type semiconductor device 5, BiCMOStype semiconductor device 5, or semiconductor device 5 with a logic anda memory.

[0094] The semiconductor device 5 mounting jig 100 or 200 (mountingboard holding jig) and method of mounting a semiconductor device 5 arenot limited to the above embodiments.

[0095] For example, in the present embodiment, suction holes 11 arearranged in a lattice on the suction plate 10 and grooves 12 arearranged crossing the suction holes 11 to form a check pattern 13,however, the arrangement of the suction holes 11 and grooves 12 can bechanged in accordance with the arrangement 41 of the lands (electrodes)41 a of the mounting board 4. The grooves 12 can be also omitted inaccordance with need.

[0096] Also, the configuration and components of the semiconductordevice 5 and the mounting board 4 are not limited to those explained inthe above embodiments.

[0097] A variety of modification other than the above can be made withinthe scope of the present invention.

[0098] Summarizing the effects of the invention, as explained above,according to a semiconductor device 5 mounting jig 100, 200 of thepresent invention, in a process of mounting a semiconductor device 5 ona flexible tape substrate 4 by flip-chip mounting, a flexible tapesubstrate 4 can be held flat and stable and, furthermore, no stress isimposed on the semiconductor device 5 at the time of releasing the hold.

[0099] Also, according to the method of mounting a semiconductor device5 of the present invention, by using the above semiconductor device 5mounting jig 100, 200 of the present invention, a flexible tapesubstrate 4 or other board 4 can be held flat and stable and asemiconductor device 5 can be mounted stably by flip-chip mounting.

[0100] While the invention has been described with reference to specificembodiment chosen for purpose of illustration, it should be apparentthat numerous modifications could be made thereto by those skilled inthe art without departing from the basic concept and scope of theinvention.

What is claimed is:
 1. (New) A semiconductor device mounting jig tomount a semiconductor device to a flexible tape substrate having aplurality of land electrodes disposed in a land electrode pattern, thejig comprising: a suction plate having a flat surface and a plurality ofsuction holes penetrated through the suction plate, wherein theplurality of suction holes are disposed in a suction pattern such thatnone of the suction holes are configured to have an area in common withany of the land electrodes; a plate support having a plate support body,wherein the plate support body defines an opening that leads to a hollowportion and wherein the suction plate is disposed in the opening of theplate support; and a suction nozzle coupled to the plate support andconfigured to provide a vacuum to the hollow portion, wherein thesuction nozzle comprises a valve.
 2. (New) The jig of claim 1, whereinthe suction plate and the plate support are solder together using a hardsolder with a high melting point.
 3. (New) The jig of claim 1, whereinthe opening of the plate support includes an O-ring disposed about aninner wall of the opening so as to be disposed between the plate supportand the suction plate.
 4. (New) The jig of claim 1, wherein the suctionplate is a first suction plate of a plurality of suction plates, whereineach suction plate includes a plurality of suction holes penetratedthrough the suction plate and disposed in a suction pattern, and whereineach suction pattern is different from the remaining suction patterns.5. (New) The jig of claim 1, further comprising: a suction pumpdetachably coupled to the suction nozzle, wherein a plurality of groovesconnects the plurality of suction holes to one another, wherein eachhole substantially is defined by a diameter of 0.01 mm to 1.00 mm, andwherein a width of each grove is equal to the diameter of a hole.